Method for manufacturing a circuit board structure, and a circuit board structure
作者： Antti Iihola , Risto Tuominen , Petteri Palm
DOI:
关键词:
摘要: This publication discloses a method for manufacturing circuit-board structure. According to the method, conductor pattern (13) is made, and contact openings are made in it component's (16) electrical contacts. After this, component attached relative (13), such way that areas or bumps of lie next openings. an electrically conductive material introduced openings, order form contacts between (16).
google.ca 参考文章(138)
Dimitry G. Grabbe, Perimeter independent precision locating member ,(1995)
Dennis F. Clocher, Joseph J. Lisowski, Joseph M. Sullivan, Glenn G. Daves, Peter M. Elenius, High performance, low cost multi-chip modle package ,(1996)
Richard Platt, Printed circuit board with embedded integrated circuit ,(2000)
Bin Lu, Dieter K. Weller, Intermediate layer for perpendicular magnetic recording media ,(2003)
Leonard Richard Douglas, Richard Joseph Saia, Kevin Matthew Durocher, James Wilson Rose, Method for aligning die to interconnect metal on flex substrate ,(1999)
Larry J. Mowatt, David Walter, Multi-chip integrated circuit module and method for fabrication thereof ,(1993)
Kenneth Taylor, Mounting semi-conductor chips ,(1985)
Eiju Maehara, Yukio Okada, Kouji Takahashi, Junji Sakamoto, Noriaki Sakamoto, Yoshiyuki Kobayashi, Yusuke Igarashi, Method of manufacturing circuit device ,(2002)
Risto Tuominen, Method for embedding a component in a base ,(2003)
Raymond A. Fillion, Robert J. Wojnarowski, Integral power and ground structure for multi-chip modules ,(1993)