The nature of mechanically polished surfaces of copper

摘要: Abstract Surfaces of copper polished with diamond abrasives were examined by transmission electron microscopy; surfaces abraded on silicon carbide papes also studied for comparison. There was no evidence an amorphous layer, known as the Beilby any surfaces; surface layers crystalline and all showed plastic deformation. Slab-shaped cells present at that appear to correspond microbands or shear bands have been observed in heavily cold-rolled copper. Some recrystallization occurred 6-μm abrasive, indicating some relaxation modification microband-shear band structure; small subgrains observed, it is concluded they recrystallized grains. The degree deformation decreased increasing fineness polish (i.e., from abrasive 1 μm). consisted almost entirely subgrains, structure these had nearly recrystallized. It concluded, however, highest temperature attained when polishing then only 100–150°C.