Memory operations using system thermal sensor data

作者: Paul Fahey , Kenneth Shoemaker

DOI:

关键词:

摘要: Memory operations using system thermal sensor data. An embodiment of a memory device includes stack including one or more coupled elements, and logic chip with the stack, controller sensors, where sensors include first located in area chip. The obtains values element is to estimate conditions for values, determination estimated being based at least part on location element. A refresh rate portions modified stack.

参考文章(61)
Akira Yabu, Yoshinori Haraguchi, Seiji Miura, Memory module, memory system, and data processing system ,(2007)
Shinzo Yamashita, 信三 山下, Power semiconductor device ,(2004)
Bryan R. Hoover, Cheng P. Tan, Robert B. Sexton, Joseph J. Castro, Keith A. Cox, Platform-independent thermal management of components in electronic devices ,(2009)
Sugato Mukherjee, Dram temperature measurement system ,(2005)
David Harry Eppes, Michael Richard Bruce, Flip chip defect analysis using liquid crystal ,(2000)