Moisture-curable hot melt silicone pressure-sensitive adhesives

摘要: There is disclosed herein a silicone pressure-sensitive adhesive composition which cures upon exposure to ambient moisture. Also disclosed, as separate embodiment, hot-melt composition. These embodiments generally comprise, tackifier, an organopolysiloxane resin containing one or more curing radicals and, linear siloxane polymer, at least diorganopolysiloxane polymer silicon-bonded hydrolyzable with organic functionality. The weight ratio of said in our compositions within the range 5:95 90:10. To these compositions, there optionally added, needed, solvent facilitate application, catalyst system cure ingredients, certain silane and/or fillers. resultant products formed from compositons have surprisingly improved strength properties and even exhibit strengths elevated temperatures.