Copper wiring module control

摘要: Techniques for controlling an output property during wafer processing include forwarding feedforward and feedback information between functional units in a manufacturing facility. At least some embodiments of the invention envision implementing such techniques copper wiring module to optimize sheet resistance or interconnect line resistance. Initially, first is measured after by plating process. Subsequently, forwarded polishing A second then one these properties are used Specifically, more target parameters process recipe adjusted manner that obtains desired final on using properties.