Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof
作者： Deok Hoon Kim , John J. H. Reche
DOI:
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摘要: A photo-sensing device package and the method of packaging such is provided. The includes an assembly portion having a substrate formed material substantially transparent to light within predetermined range wavelengths; sensing including at least one die photo-electronically transducing and, plurality first solder joints joining portions. with metal layer disposed on about front surface region thereof; passivation extend over layer. patterned define second access openings which respectively describe bump pads, each interconnected pads. portion's positioned its area opposing substrate, has thereon pads electrically coupled area. Each extends between
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