Heat-resistant and high thermal conductive adhesive
作者： Katsumi Yoshino , Takashi Yoshioka , Toshiyuki Ueno , Kiminori Sato , Wei Feng
DOI:
关键词:
摘要: An object of the present invention is to provide a heat-resistant and high thermal conductive adhesive having excellent mechanical strength, heat resistance, conductivity. A includes: (a) first component in which carbon-based filler surface-modified with reactive functional group an polymer matrix second are bonded by addition condensation reaction group; (b) containing third group, wherein causing application light or heat.
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