作者: Dinesh N. Khanna , Werner H. Mueller , Bernd Hupfer
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摘要: This invention is that of high temperature polyamides containing the hexafluoroisopropylidene group. The and photo or radiation sensitizers provide improved positive resists which can be developed in aqueous alkaline developer thermally anneal to form heat resistant, polyoxazole relief structures suitable for use microelectronic printing applications. photoresists have solubility coating solvents photospeed. prepared by conventional condensation reactions; e.g. a diamine diacid chloride. In addition this protective coatings with superior adhesion properties applications other than photoresist area.