Method of making microwave circuit package
作者： Jorge M. Hernandez , Norman L. Greenman , M. P. Ramachandra Panicker
DOI:
关键词:
摘要: A low cost microwave circuit package having high performance characteristics is disclosed. The operates in the frequency range up to 90 GHz while requiring less space on printed board. Space savings provided by small components and leadless design of package. Taking place leads a ball grid array RF ports. An unlimited number layout designs are possible within an s! matrix close ##EQU1## operating band package, for any pair signal transmission
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