Connecting board with oval-shaped protrusions
作者： Hajime Saiki , Kozo Yamasaki
DOI:
关键词:
摘要: A connecting board is provided for disposition between a base plate such as LGA and mounting printed circuit board. The has substrate having plurality of through holes. Each hole extends opposite first second surfaces the includes portions continuous oval shape. An easily deformable soft metal body mounted in each way to have protruded protruding from substrate. are different height. connected at heights set depending upon materials coefficients thermal expansion plate, By making other, distance desiredly.
google.gr 参考文章(21)
Chikara Yamashita, Method for manufacturing a sheet formed connector for inspection of an integrated circuit ,(1994)
Shunsuke Tazai, Ryu Maeda, Akira Tateishi, Electrical connectors using anisotropic conductive films ,(1996)
Kenneth Credle, John McConnell, Christopher G. Wolf, Ceramic substrates with highly conductive metal vias ,(1992)
Frank Kolman, Kevin Haley, Method of making solder shape array package ,(1994)
Edward L. Yankowski, John R. Behun, Bert H. Newman, William R. Miller, Process of fabricating a circuit package ,(1989)
Bruno T. Klingel, Karl G. Hoebener, John R. Behun, John C. Milliken, Anson J. Call, Marie S. Cole, Francis F. Cappo, Interconnection structure and test method ,(1990)
Masao Kubo, Yoshimitsu Nakamura, Kazuo Kamada, Masanobu Ogasawara, Terminal-carrying circuit board ,(1995)
Alexis Bitaillou, Michel Joseph Grandguillot, Method of forming solder terminals for a pinless ceramic module ,(1986)
Yasuteru Ichida, Masaaki Imaizumi, Hideyuki Nishida, Tetsuo Yoshizawa, Masaki Konishi, Takashi Sakaki, Hiroshi Kondo, Electrically connecting member and electric circuit member ,(1988)