Methods for bonding substrates

作者: David Carlton Ordway , Michael Devin Long , Uwe Schneider

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摘要: A method for mechanically deforming, such as by bonding, a substrate assembly. The assembly may be advanced at first velocity toward bonder apparatus. apparatus rotate second velocity, which is less than or equal to the velocity. include support surface and process contracted prior advancing onto receive leading portion of subsequent trailing portion. define product arc length, pitch. One more processes performed on then removed from through metering that exits expanded are separated