作者: Yutaka Aoki , Yasushi Hirokawa , Atsushi Takei , Yusuke Masuda
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摘要: Disclosed are a multilayer styrenic resin sheet including 10 to 50 laminated layers which each made of composition that includes 29 65 mass % styrene/conjugated diene copolymer (A), 51 15 polystyrene (B) and 20 9 an impact-resistant (C) have average thickness 2 μm; packaging material (such as carrier tape or tray) for electronic components is formed from the sheet. The melt tension at 220° C. preferably 30 mN, content conjugated 25 relative 100 (A).