Apparatus and process for manufacturing solder balls

作者: Jung-Hoon Chun , Juan C Rocha , Nannaji Saka , Richard F Foulke

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摘要: An apparatus and method of forming fluxless solder balls includes from a supply solder. A coating is formed on the for limiting naturally occurring oxide growth before significant natural has occurred. The allows to be soldered without using flux.

参考文章(13)
Kenzo Hanawa, Kiyotaka Mitsui Mining Smelting Co.Ltd. Yanagi, Unleaded solder powder and production method therefor ,(1999)
Jung-Hoon Chun, Christian H. Passow, Production of charged uniformly sized metal droplets ,(1992)
Yasuki Shimamura, Shuichi Nakata, Functional alloy particles ,(2001)
Jeffrey Stuart Coombs, Production of powder ,(1994)
Donald J. Hayes, Mary W. Hartnett, Manufacture of coated spheres ,(1995)
Nobuo Tajima, Yoshihiro Miyano, Makoto Inoue, Takashi Shimmura, Solder powders coated with fluorine compounds, and solder pastes ,(1988)
Jung-Hoon Chun, Christian H. Passow, Manish H. Bhatia, Apparatus for applying uniform metal coatings ,(1993)