Film Deposition by Energetic Condensation

摘要: When the plasma ions arrive at a surface, they do so with considerable kinetic energy, which is typically in range 20–150 eV without bias. A bias voltage can increase this energy even further. Energetic condensation involves subsurface processes when arriving displace surface and near-surface to come rest below surface. Shallow ion implantation or “subplantation” occurs, leading dense hard coatings that are generally under high compressive stress. Hardness stress related. Excessive detrimental because it lead catastrophic failure of coating by delamination. Stress control becomes paramount for high-performing coatings. This be addressed utilizing degree ionization: biasing substrate very efficient giving controlled, capable generating small collision cascades layer solid. relieved through atom rearrangement facilitated short period mobility. best controlled sophisticated techniques, such as pulsed optimized pulse duration duty cycle. One maximize relief while maintaining an overall level hardness elastic modulus.