Adhesive Joints for Low- and High-Temperature Use: An Overview
作者： E. A. S. Marques , Lucas F. M. da Silva , M. D. Banea , R. J. C. Carbas
DOI: 10.1080/00218464.2014.943395
关键词:
摘要: … been a major limitation of adhesives that, given their polymeric … to improve the temperature resistance of adhesive joints, and this … adhesive shrinkage and thermal expansion, adhesive …
sci-hub.se 参考文章(81)
D. Evans, G.B. Stapleton, J.T. Morgan, EPOXY RESINS FOR SUPERCONDUCTING MAGNET ENCAPSULATION. ,(1972)
Vishal Mallick, Stress analysis of metal/CFRP adhesive joints subjected to the effects of thermal stress University of Bristol. ,(1989)
Handbook of adhesion technology Springer Heidelberg. ,(2011) , 10.1007/978-3-319-42087-5
Cornelia Blanke, Modellierung und numerische Simulation des Aufheizverhaltens von PKW-Bauteilen und -Karossen in Trocknern Technische Universität. ,(2009)
M.D. Banea, L.F.M. da Silva, R.D.S.G. Campilho, Effect of Temperature on Tensile Strength and Mode I Fracture Toughness of a High Temperature Epoxy Adhesive Journal of Adhesion Science and Technology. ,vol. 26, pp. 939- 953 ,(2012) , 10.1163/156856111X593649
Katsutoshi MIZUNO, Masafumi OGATA, Ken NAGASHIMA, An Innovative Superconducting Coil Fabrication Method with YBCO Coated Conductors Quarterly Report of Rtri. ,vol. 54, pp. 46- 51 ,(2013) , 10.2219/RTRIQR.54.46
M. D. Banea, L. F. M. da Silva, Static and fatigue behaviour of room temperature vulcanising silicone adhesives for high temperature aerospace applications. Statisches Verhalten und Dauerfestigkeitsanalyse von vulkanisierten Silikonklebstoffen für Luftfahrtanwendungen bei hohen Temperaturen Materialwissenschaft Und Werkstofftechnik. ,vol. 41, pp. 325- 335 ,(2010) , 10.1002/MAWE.201000605
Lucas F. M. da Silva, R. D. Adams, Stress-free temperature in a mixed-adhesive joint Journal of Adhesion Science and Technology. ,vol. 20, pp. 1705- 1726 ,(2006) , 10.1163/156856106779024436
Naveen Rastogi, Som R Soni, Arvind Nagar, Thermal stresses in aluminum-to-composite double-lap bounded joints Advances in Engineering Software. ,vol. 29, pp. 273- 281 ,(1998) , 10.1016/S0965-9978(97)00079-3
Douglas B. Adolf, Robert S. Chambers, A thermodynamically consistent, nonlinear viscoelastic approach for modeling thermosets during cure Journal of Rheology. ,vol. 51, pp. 23- 50 ,(2007) , 10.1122/1.2360670