Method for bonding flexible substrate
作者： Minakuchi Daisuke , Takagi Yoshinori , Sakuma Haruya , Ichikawa Ryo
DOI:
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摘要: To provide a method for bonding flexible substrate, said making it possible to bond the substrate using reflow furnace. A 1 is mounted on transfer jig 2A, solder paste applied an electrode of 4 correction plate 5, 5 placed melted by being heated in furnace, and are bonded each other means solder.
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