Multiple part compliant interface for packaging of a semiconductor chip and method therefor

摘要: A method of making a multiple part compliant interface for microelectronic package including the steps providing first element having electrically conductive parts, an array curable elastomer support pads in contact with element, curing while remain and adhesive pads, whereby each pad is disposed over substantial alignment one pads. second parts then assembled by abutting against compressing between elements. The are cured elements interconnected. define channels running any two adjacent flowable encapsulant may be within after connecting step. Preferably, comprise substantially similar materials, such as silicone, order to avoid problems associated thermal cycling, air entrapment and/or voiding.