作者: N. Herscovici
DOI: 10.1109/8.686766
关键词:
摘要: Printed microstrip antennas and arrays are known to have limitations in terms of bandwidth efficiency, all imposed by the very presence dielectric substrate. Microstrip printed on a thin film separated from ground-plane foam were successfully designed; however, fabrication difficulties associated with use considerably increases cost. In this paper, new concept is presented. Rather than using superstrata geometry, "printed circuit" etched out metal supported at "strategic points" (metallic or nonmetallic) posts. The main motivation for work was obtain large arrays, which exhibit higher efficiency conventional ones, can be fabricated inexpensive quantity production techniques. However, technology also used develop many types antennas. elements based designed L, S, C bands.