Packaging jig and process for semiconductor packaging
作者： Chi-Ming Huang , Tsung-Ding Wang
DOI:
关键词:
摘要: An embodiment is a method for semiconductor packaging. The comprises attaching chip to carrier substrate through first side of jig, the being attached by bumps; applying balls bond pads on second jig; and simultaneously reflowing bumps balls. According further embodiment, packaging jig cover, base, connector. cover has window cover. base base. exposes surface volume intermediate volume. opposite from surface. connector aligns couples
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