Light-emitting dies incorporating wavelength-conversion materials and related methods
作者： Michael Albert Tischler
DOI:
关键词:
摘要: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting and/or composite wafers containing multiple in a single volume of binder.
glgoo.top参考文章(173)
Kay S. Essig, Bernd K. Appelt, Stackable wafer level packages and related methods ,(2011)
Peter R. Harper, Joy T. Jones, Christopher F. Edwards, Phillip J. Benzel, Nicole D. Kerness, Arkadii V. Samoilov, Richard I. Olsen, Multichip wafer level package (WLP) optical device ,(2013)
Jill A. Rowehl, Karen K. Gleason, Miles C. Barr, Vladimir Bulovic, Conductive Polymer on a Textured or Plastic Substrate ,(2010)
Noam Meir, LED-Based Replacement Lamps for Incandescent Fixtures ,(2010)
Alexander Shaikevitch, Elongated lenses for use in light emitting apparatuses ,(2011)
Alexander Shaikevitch, Methods of manufacturing elongated lenses for use in light emitting apparatuses ,(2011)
Helmut Fischer, Dieter Eissler, Alexander Heindl, Method of Producing Optoelectronic Components and Optoelectronic Component ,(2008)
Nathaniel O. Cannon, Brian Thomas Collins, Jasper Cabalu, Matthew Donofrio, Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices ,(2011)
Tao Tong, Bernd Keller, Eric Tarsa, Ronan Letoquin, Led lamp incorporating remote phosphor with heat dissipation features ,(2011)