Method for producing circuit board and circuit board

作者: Akihiro Nomoto

DOI:

关键词:

摘要: A method for producing a circuit board, the includes steps of: forming lower wiring pattern on substrate; an insulating film substrate to cover pattern; opening in expose upper film; and interconnect material sidewall of connecting pattern.

参考文章(29)
Lloyd G Arndt, Through hole connectors ,(1970)
Doo Hwan Lee, Myung Sam Kang, Chang Sup Ryu, Jin Yong Ahn, Suk Hyeon Cho, Printed circuit board including embedded chips and method of fabricating the same ,(2005)
Mark Bale, Mark Garbett, Jeremy Henley Burroughes, Jonathan J. Halls, Active matrix optical device ,(2008)
Helen Zhu, Rao Annapragada, An etch back process using nitrous oxide ,(2003)
Hideki Uochi, Toshimitsu Konuma, Mitsunori Sakama, Shunpei Yamazaki, Masahiko Hayakawa, Semiconductor device with a tapered hole formed using multiple layers with different etching rates ,(2002)
Richard Henry Friend, Henning Sirringhaus, Takeo Kawase, Inkjet-fabricated integrated circuits ,(2000)
Liping Ma, Michael L. Beigel, Yang Yang, Method of creating a high performance organic semiconductor device ,(2003)