Method for manufacturing connection structure

摘要: A connection structure manufacturing method for obtaining a in which first and second terminals are electrically connected, comprises disposing the (connection of semiconductor element) facing circuit board) through agency thermosetting anisotropic conductive adhesive (anisotropic film), pressing while heating curing adhesive. The rate is kept at 50 mm/min or less, brought into contact particles before viscosity reaches 10 7 Pa·s as result curing.