Interdependence between the curing, structure, and the mechanical properties of phenolic resins

作者: J. Wolfrum , G. W. Ehrenstein

DOI: 10.1002/(SICI)1097-4628(19991220)74:13<3173::AID-APP21>3.0.CO;2-6

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摘要: The interdependence between the curing conditions, structure, and mechanical properties of tow neat phenolic resin systems was investigated. Changes distribution void diameters were characterized by light- an scanning electron microscope analyses. Tensile tests dynamic thermo analysis performed to determine influence hardener concentration temperature on thermomechanical properties. study reveals that predominately influenced microscopic thus systems. By varying postcuring times, it can be shown independent from microstructure system, degree cure has a strong © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 3173–3185,

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