45° light turning mirrors for hybrid integration of silica optical waveguides and photo-detectors

摘要: For hybrid integration of an optical chip with electronic photo diodes and processing, light must be coupled from the to chip. This paper presents a method fabricate metal-free 45° quasi-total internal reflecting mirrors in chips that enable 90° out-of-plane coupling between flip-chip bonded chips. is fully compatible fabrication conventional The are created using anisotropic etching facets Si substrate followed by structures. After removal mirror-defining structures isotropic etching, obtained air-optical structure interface directs output waveguides detectors mounted on Simulations show reflection efficiency 72.3 %, while experimentally 47% was measured not optimized first batch.