Photosensitive module and method for forming the same
作者： Po-Chang Huang , Chi-Chang Liao , Tsang-Yu Liu
DOI:
关键词:
摘要: A method for forming a photosensitive module is provided. The includes providing sensing device. device substrate having first surface and second opposite thereto. conducting pad located on the surface. opening penetrates exposes pad. redistribution layer in to electrically connect cover plate covers also bonding circuit board. removed after further mounting an optical component corresponding formed by
lens.org 参考文章(21)
Yu-Lung Huang, Tzu-Hsiang Hung, Yen-Shih Ho, Image sensor chip package and method for forming the same ,(2011)
Wael Zohni, Richard DeWitt Crisp, Belgacem Haba, Flip-chip, face-up and face-down centerbond memory wirebond assemblies ,(2011)
Yoshiki Takayama, Tetsushi Nishio, Toshiyuki Fukuda, Kiyokazu Itoi, Tetsumasa Maruo, Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device ,(2008)
Brenda Dingle, Ngwe Cheong, Duy-Phach Vu, High density electronic circuit modules ,(1993)
Chia-Lun Tsai, Chia-Ming Cheng, Tsang-Yu Liu, Chip package and fabrication method thereof ,(2010)
Warren M. Farnworth, Alan G. Wood, Microelectronic imaging devices and associated methods for attaching transmissive elements ,(2006)
Tung-Chuan Wang, Diann-Fang Lin, Wen-Kun Yang, Jui-Hsien Chang, Image sensor module having build-in package cavity and the method of the same ,(2007)
Jung-hyun Cho, Jong-woo Kim, Image sensing device having protection pattern on the microlens, camera module, and method of forming the same ,(2007)
Larry D Kinsman, Luke England, Packaging methods for imager devices ,(2008)