Ultra-precision grinding
作者： E. Brinksmeier , Y. Mutlugünes , F. Klocke , J.C. Aurich , P. Shore
DOI: 10.1016/J.CIRP.2010.05.001
关键词:
摘要: … grinding experiments were done with a fine grained resin bonded diamond wheel (D3), a depth of cut … it is possible to maintain tool normal conditions, ie the circular grinding zone of the …
core.ac.uk
elsevier.com
sci-hub.se 参考文章(134)
G. J. Pietsch, M. Kerstan, Simultaneous double-disk grinding: Machining process for flat, low-damage and material-saving silicon wafer substrate manufacturing euspen : european society for precision engineering and nanotechnology. International conference. pp. 644- 647 ,(2001)
Jr. Walter J. Sherwood, Ceramic bonded abrasive ,(2001)
Milton C. Shaw, Milton Clayton Shaw, Principles of Abrasive Processing ,(1996)
S. Danyluk, Smoother Scribing of Silicon Wafers ,(1986)
Paul Shore, Machining of Optical Surfaces in Brittle Materials using an Ultra-Precision Machine Tool Cranfield University. ,(1995)
Xavier Tonnellier, Precision grinding for rapid manufacturing of large optics Cranfield University. ,(2009)
C. L. Chao, K. J. Ma, D. S. Liu, S. C. Sheu, Y. S. Lin, H. Y. Lin, A Study on the Surface Integrity of Single Crystal Silicon Ground by CIFB-diamond Wheels(ELID) and Resin-bonded Diamond Wheels Springer, Boston, MA. pp. 376- 380 ,(2002) , 10.1007/0-306-47000-4_73
Shao Hui Yin, Wei Min Lin, Yoshihiro Uehara, Shinya MORITA, Hitoshi Ohmori, Muneaki Asami, M. Ohmori, Development on Micro Precision Truing Method of ELID-Grinding Wheel (2nd Report: Application to Edge Sharpening of Large Wheel) Key Engineering Materials. pp. 213- 220 ,(2005) , 10.4028/WWW.SCIENTIFIC.NET/KEM.291-292.213
Martin G. Schinker, Subsurface damage mechanisms at high-speed ductile machining of optical glasses Precision Engineering. ,vol. 13, pp. 208- 218 ,(1991) , 10.1016/0141-6359(91)90100-W