Force and Temperature Modeling in 5 - axis Grinding

作者: Raja Kountanya , Changsheng Guo

DOI: 10.1016/J.PROMFG.2018.07.061

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摘要: Abstract Building upon a recently published (J. Manuf. Sci. Eng. 2017;. doi:10.1115/1.4037969) general geometrical framework for specific removal rate, the current paper develops physics in 5 - axis grinding (5AG). Relating grain-level chip thickness h to wheel-local material rate per unit area m”, force components from chip-formation, plowing and sliding, resolved normal tangential tool surface locally were considered. A new approach model steady-state workpiece temperatures small tool-workpiece contact areas is shown. composite Green’s function moving heat-source two solutions literature, near- far-field, was synthesized. representative 2D patch on nominal plane its travel speed formulated instantaneous 3D tool-work local feed-rate variation. From sliding power, prescribed heat-partition linear superposition of heat sources, temperature variation over complete calculated. For shallow-cut (SCSG), validated with experimental data nickel alloy electroplated CBN wheels. Peak SCSG thermal found be reasonable agreement classical Jaeger model. Examples heat-flux distribution few individual moves 5AG smaller

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