A new dynamic recrystallisation model of an extruded Al-Cu-Li alloy during high-temperature deformation

摘要: Abstract The high-temperature deformation behaviour and microstructure evolution of an extruded Al-Cu-Li alloy were investigated by compression tests conducted at various temperatures (613, 673 733 K) with strain rates (0.001, 0.01, 0.1 s -1 ). results indicated that the activation energy increased from 208.7 kJ/mol to 255.7 kJ/mol increase in 0.1 0.7. electron backscatter diffraction maps a dynamic recrystallisation occurred during deformation. Two types mechanisms, grain boundary bulging transformation low misorientation high misorientation, considered as mechanisms for controlling formation recrystallised grains. A new model containing these two was proposed describe alloy. At early stage deformation, grains formed along original boundaries. With increasing strain, gradually generated deformed due angle boundaries