Method and apparatus for improving silicon processing efficiency

作者: Terence Lee Horstman , Arvid Neil Arvidson , Chris Tim Schmidt , Kathryn Elizabeth Messner , Todd Stanley Graham

DOI:

关键词:

摘要: A method for processing polycrystalline silicon workpieces to form size distributions of pieces suitable use in a Czochralski-type process includes: (1) preparing workpiece by chemical vapor deposition process; (2) fracturing the into mixture pieces, where have varying sizes; and (3) sorting at least two distributions. Step may be carried out thermal shock process. using rotary indent classifier. classifier performing (i) rotating cylinder having circumferential edge with indents arrayed increasing from first end second cylinder, (ii) conveyor running longitudinally adjacent conveying cylinder.

参考文章(40)
Dirk Flottmann, Reinhard Wolf, Gerhard Ast, Method and device for processing semiconductor material ,(1999)
Akio Omure, 昭夫 大牟礼, Katsuya Morizaki, 勝也 森崎, Crushing method of polycrystalline silicon ,(1996)
Kazuhiro Hanazawa, Masamichi Abe, 嘉英 加藤, Hiroyuki Baba, 憲吉 湯下, Kenkichi Yushimo, 和浩 花澤, Yoshihide Kato, 正道 阿部, 尚道 中村, 裕幸 馬場, Naomichi Nakamura, Fracturing method and device of silicon block ,(1998)
Tsuneo Mizoguchi, Masakatsu Takeguchi, Tsutomu Mase, Method and device for crushing polycrystalline silicon ,(1988)
Akio Omure, 昭夫 大牟礼, Method for crushing polycrystalline silicon ,(1993)
Yamamoto Takashi, Take Masayuki, Nakano Mamoru, Ito Hideo, METHOD FOR CRUSHING POLYCRYSTALLINE SILICON ,(1995)
Imai Masato, Kawabata Naoki, Yatsurugi Yoshifumi, METHOD OF CRUSHING SILICON FOR SEMICONDUCTOR ,(1988)