Analysis of low-temperature intermetallic growth in copper-tin diffusion couples

摘要: A multiphase diffusion model was constructed and used to analyze the growth of the ε-and η-phase intermetallic layers at a plane Cu-Sn interface in a semi-infinite diffusion couple. Experimental measurements of intermetallic layer growth were used to compute the interdiffusivities in the ε and η phases and the positions of the interfaces as a function of time. The results suggest that interdiffusion in the ε phase (≈ D ε) is well fit by an Arrhenius expression with D 0= 5.48× 10− 9 m 2/s and Q= 61.9 kJ/mole, while that in the η phase (≈ D …