3D Printing multifunctionality: structures with electronics

摘要: While NASA explores the power of 3D printing in development next generation space exploration vehicle, a CubeSat Trailblazer was launched November 2013 that integrated 3D-printed structures with embedded electronics. Space provides harsh environment necessary to demonstrate durability devices radiation, extreme thermal cycling, and low pressure—all assaulting structure at atomic macroscales. Consequently, are operational orbit can be relied upon many terrestrial environments—including defense biomedical applications. The module (a subsystem occupying approximately 10 % total volume offered by × 10-cm enclosure) has substrate fits specifically into available volume—exploiting provide volumetric efficiency. Based on best fabrication technology time for electronics, stereolithography (SL), vat photopolymerization technology, used fabricate dielectric structure, while conductive inks were dispensed channels electrical interconnect between components. In spite passing qualification—including temperature shock vibration, outgas testing—the photocurable materials SL do not level required long-term functionality. Moreover, low-temperature curing capabilities as material widely known suboptimal performance terms conductivity. To address these challenges future machine is under being referred multi3D system, which denotes use multiple technologies produce 3D, multi-material, multifunctional devices. an extrusion process replace polymers thermoplastics, system based fused deposition modeling (FDM) been developed integrates other compensate FDM’s deficiencies surface finish, minimum dimensional feature size, porosity. Additionally, minimize inks, novel embedding submerges copper wires thermoplastic during FDM interruptions—providing high performance, robust interconnect, ground planes—and serendipitously improving mechanical properties structure. This paper compares contrasts electronics FDM-based through experimental results demonstrates automated producing features achievable alone. addition possibility using direct write electronic circuitry, uses thermoplastics offer substantial improvement