Optimization of solid-state diffusion bonding of Hastelloy C-22 for micro heat exchanger applications by coupling of experiments and simulations

摘要: Abstract The paper presents an optimization of diffusion bonding processes Hastelloy C-22 based on the coupling experiments and model simulations for manufacturing micro heat exchangers chemical applications. A systematic work is begun with experimental investigations influences temperature microstructures mechanical properties material to be bonded. Based these, optimal determined. To predict remaining parameters, a used. used as input parameters are provided by tensile creep tests. calculations yielded optimized parameter set 1050 °C, 26 MPa 3.6 h given surface roughness. This verified using sheet various compression stresses, durations Bonding this successfully conducted, which in turn resulted sound seam. strength was comparable that base toughness higher than 50% material.