Thermoelectric devices and methods for making the same

摘要: Thermoelectric devices having enhanced thermal characteristics are fabricated using multilayer ceramic (MLC) technology methods. Aluminum nitride faceplates with embedded electrical connections provide the series configuration for alternating dissimilar semiconducting materials. Embedded formed by vias and lines in faceplate. A portion of materials then melted within tunnels to form a bond. Thermal conductivity faceplate is adding electrically isolated one surface, filled high metal paste. low material also introduced between two faceplates. Alternating varying layers punching greensheets predetermined filling n-type p-type paste or may be patterned linear radial fanout patterns through screening techniques lamination wire structures. liquid channel used enhance energy transfer. physically incorporated IC package MLC technology.