Chemisorption of copper atoms on platinized platinum in sulphuric acid solution

摘要: The cathodic formation and the anodic removal of chemisorbed layers copper atoms was studied at room temperature on platinized platinum in 0.5 MH2SO4+X M CuSO4 . 5 H2O (3.10–4⩽X⩽ 10–1) potentials positive to that reversible electrode respective solution. initial rate layer is controlled by mass transport processes a slow step discharge reactions small bulk concentrations (10–3 M) Cu2+ions. maximum number adsorption sites are covered Cuad large decreases with potential. It equal for hydrogen 0.3 V zero 0.8 V. One covers one site Had first approximation. When coverage about half, effect can be described as repulsive between 0.2 attractive 0