作者: Erno H Klaassen , Richard J Reay , Christopher Storment , Gregory T.A Kovacs
DOI: 10.1016/S0924-4247(97)80223-3
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摘要: Abstract This paper details a post-processing technique by which circuitry in an unmodified IC technology is thermally and electrically isolated from the silicon substrate. method enables new applications for micromachining, including temperature regulation of analog ICs, to be carried out. The process discussed detail, along with improved tetramethyl ammonium hydroxide (TMAH) etching chemistries that use strong oxidizers eliminate hillock formation. Also presented electrochemical biasing uses on being etched during micromachining step. Work currently underway evaluate these techniques commercial circuit applications, several are discussed.