Packaging structural member
作者： Ravi Kanth Kolan , Yi Sheng Anthony Sun , Chin Hock Toh , Xue Ren Zhang
DOI:
关键词:
摘要: A structural member for use in semiconductor packaging is disclosed. The includes a plurality of regions to facilitate dies in, example, wafer format. region has die attach surrounded by peripheral region. attached the In one aspect, opening through surfaces accommodating die. Through-vias disposed are regions. reduces warpage that can occur during curing mold compound used encapsulating dies. another does not have an opening. such cases, serves as interposer between and substrate.
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