EMF shielding of an integrated circuit package

摘要: A package for housing integrated circuit chips that provides EMF shielding and thermal protection, while conforming to an industry recognized outline, is provided. This protection achieved by providing electrically conductive heat sink (10) dissipation that, together with a separate layer (12), also acts as shield. The contains recess (11) positioned against the (12) facing (12). (8) resides inside cavity formed protected from (10), IC are then encapsulated in insulating molding compound (34) molded outline. Additional ICs (38) can be housed this attaching them side of opposite (10). These additional emanating cavity. allows possibility EMF-generating components EMF-sensitive same package.