作者: Anirban Bandyopadhyay , Behzad Fardi , Chaoyang Li , Farshid Adibi , Mahesh Junnarkar
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摘要: A thermo-optic device may be formed with trenches that undercut the substrate beneath device. Through removal of underlying substrate, heat dissipation reduced. This reduce thermal budget device, reducing power requirements for operating in some embodiments.