Investigation of moisture-induced failures of stacked-die package
作者： Hak Sung Kim , Ho Geon Song
DOI: 10.1016/J.MICROREL.2007.07.014
关键词:
摘要: The present work studies the moisture induced failures of a stacked-die package. study includes various experimental tests to find characteristics constituent packaging materials such as interfacial strength, hygro-swelling property and vapor pressure, comprehensive finite element analysis integrating effects stress, thermo-mechanical stress pressure. Specifically, pressures with respect concentration temperature in epoxy molding compound were characterized experimentally by combined TMA/TGA technique. In numerical analysis, delamination was newly simulated applying cohesive modeling technique, which quadratic traction damage initiation law an exponential displacement separation used.
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