Electroless Deposition of Highly Solderable Fe-Ni Films
作者： Haifei Zhou , Jingdong Guo , Jianku Shang
DOI: 10.1149/2.094306JES
关键词:
摘要: The simultaneous electroless-deposition of Fe and Ni is challenging because has a more negative standard reduction potential than Ni. In this study, FeNiP electroless deposits with content up to 97 at.% were prepared by complexing disodium ethylene diamine tetraacetate (EDTA-2Na). addition ETDA-2Na agent effectively reduced the difference in electrode between from 0.21 V 0.156 V, resulting Fe-Ni depositions very high concentrations. iron concentrations deposited films systematically investigated as functions bath temperature, EDTA-2Na DTPA, mole ratio Fe2+/Ni2+ contents NH3 center dot H2O plating bath. solderability Sn SnAgCu solders was found increase 0 85 at.%, be better that NiP. (C) 2013 Electrochemical Society. All rights reserved.
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