Metallurgical considerations with respect to electrodes and interconnection lines for Josephson tunneling circuits

摘要: A description is presented of the composition, structure, and thermal stability Pb‐alloy films which were used in process described by Greiner et al. for fabricating experimental Josephson tunneling circuits. The to form tunneling‐junction electrodes, controls, interconnection lines; they consisted Pb with In and/or Au additions. Both additions base lines whereas only was added case counterelectrodes. Each contained an intermetallic compound, believed cause some mechanical strenghtening. contained, addition, a Pb–In solid solution phase. Tunneling junctions gates fabricated through use indicated types displayed characteristics suitable circuit operation.