Connected sensor substrate for blister packs
作者： Ivan Spogreev , Victor Gusev Lesau
DOI:
关键词:
摘要: A blister pack for dispensing medication comprises a substantially flat backing, blisters formed on the breakable resistive traces, conductive power source applying electrical to and controller. The backing form cavities containing medication, each is coupled with another pairs of blisters. Resistive traces are applied under blister. For pair blisters, first connected in parallel by second controller detects breakage measuring voltage across communicate status remote server instant analysis reporting parties interest.
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