Solid-state imaging device and method of production of the same
作者： Takeshi Sano , Hiroshi Takemoto , Yoshihiro Morii , Toshio Kobayashi , Jun Andoh
DOI:
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摘要: In a solid-state imaging device and its production method according to the present invention, image sensor has an effective light-receiving region on circuit formation surface provided in face-down condition. A transparent substrate conductor pattern thereon confront of sensor. adhesive agent is between formed into thin layer, covering plurality bumps are one interconnect substrate.
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