High-density multilayer interconnection system on a ceramic substrate for high current applications and method of manufacture

摘要: High density/heavy current hybrid circuit on a ceramic substrate, or other insulating board material, includes first screen printed silver, copper, polymer seed layer for basic circuitry and bus bar around this outside the scribe lines, which is connected by removable silver filled links with also elements are each same in order to provide uniform electroplating. The protected before electroplating plating resist they removed after using an appropriate stripping solution. Then permanent dielectric thick film isolation applied (for crossovers) second applied, of metal occurs so until desired number layers done. Thus, cure temperature that polymerization, high density, good heat dissipation conditions, heavy capacity all low manufacturing costs achieved.