Method for attaching conductive balls to a substrate
作者： Fonzell D. J. Martin , Howard P. Wilson
DOI:
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摘要: Conductive balls (44), preferably solder balls, are attached to pads (32) on a substrate (30) using vacuum pick-up tool (34). The lowers the conductive into bath of flux (48) without allowing touch bottom recess (47) in plate (46), thereby reducing likelihood dislodging from tool. withdraws flux, and aligns with respective substrate. Once positioned, released A reflow operation metallurgically bonds pads.
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