Life Estimation For IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics
作者： A. Nishimura , A. Tatemichi , H. Miura , T. Sakamoto
DOI: 10.1109/TCHMT.1987.1134777
关键词:
摘要: The strength of plastic encapsulants is analyzed from the viewpoint crack propagation. With a preexisting length and specific number applied load cycles N, fatigue propagation rates da/dN were measured with laboratory test specimens. It was found that can be expressed as functions stress intensity factor range \Delta K. behavior in package estimated data K at lowest temperature cycles. Reasonable correlation between observed one. applicability fracture mechanics to Cracking problem demonstrated.
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