Molded parts from hot melt adhesives
作者： Carsten Friese , Siegfried Kopannia , Rainer Schönfeld
DOI:
关键词:
摘要: The invention relates to a molded part for bonding metal or plastic substrates use as fastening element. Said comprises hot melt adhesive, said adhesive being based on polyamide, polyolefins, polyesters, polyacrylates polystyrene. according the is characterized in that has softening point between 100° and 250°C, tensile stress at yield of 1 35 MPa consists entirely adhesive. also method parts from adhesives by way inductive heating.
lens.org 参考文章(13)
Ulrike Maassen, Siegfried Kopannia, Reimar Heucher, Polyamide hotmelt adhesive ,(1997)
Charles R. Frihart, Curable adhesive compositions containing polyamide resins ,(1994)
Wilhelm Thilo, Reimer Hanson, Kurt Carlson, Apparatus for molding with hot melt adhesives ,(2002)
Georg Schubert, Bettina Becker, Thomas Huver, Angela Rossini, Thomas Moeller, Method for forming moldings from dimer fatty acid free polyamides ,(2001)
Georg Schubert, Michael Krebs, Karin Jonscher, Roland Heider, Moldings of polyurethane hotmelt adhesives ,(1995)
Stefan Frey, Markus Fath, Emil Wilding, Thermoplastic stiffening material used for manufacturing shoes, and a method for the production thereof ,(2004)
Thomas H. McGaffigan, Temperature auto-regulating, self-heating recoverable articles ,(1989)
Gerhard Poessnecker, Jurgen Spindler, Eberhard Kinkelin, Copolyether ester hot-melt masses ,(1997)
Angela Rossini, Francesco Meda, Long open time hotmelts based on polyamides ,(1998)