Method for forming via holes in multilayer circuits
作者： Thomas D. Lantzer , Jay R. Dorfman , Arthur H. Mones , Richard R. Draudt , David L. Sutton
DOI:
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摘要: The invention is directed to a method for rapidly forming dense pattern of via holes in multilayer electronic circuits which the dielectric layers are formed by drilling with an excimer laser under controlled operating conditions.
google.co.uk 参考文章(6)
Daniel C. Van Hart, Cynthia J. Moring, Frank D. Egitto, Removal of excimer laser debris using carbon dioxide laser ,(1991)
T.G. Tessier, G. Chandler, Compatibility of common MCM-D dielectrics with scanning laser ablation-via generation processes electronic components and technology conference. ,vol. 16, pp. 39- 45 ,(1992) , 10.1109/33.214858
John Walter Lott, Thomas Raymond Poulin, Patrick Walter Wallace, Chip carrier package and method of manufacture ,(1990)
Ellen R. Tappon, John B. Smyth, Flexible circuit card with laser-contoured VIAs and machined capacitors ,(1991)
Ellen R. Tappon, John B. Smyth, Method for making flexible circuit card with laser-contoured vias and machined capacitors ,(1990)
Joseph Richard Rellick, Method for fabricating multilayer circuits ,(1989)