Low thermal impedance light-emitting diode package

摘要: Disclosed is an assembly for relatively high power light-emitting semiconductor devices that uses simple inexpensive components and construction to provide a heat coupler reduces the thermal impedance between active device ambient atmosphere by approximately factor of ten from comparable not incorporating inventive coupler. The directly mounted on fabricated material having good conductivity, such as copper, copper alloys, or aluminum, designed have large surface area, at least times area bonding device, in unobstructed contact with atmosphere, thereby providing efficient coupling source ultimate sink.