Non-Fickian moisture properties characterisation and diffusion modeling for electronic packages

作者: E.H. Wong , K.C. Chan , T.B. Lim , T.F. Lam

DOI: 10.1109/ECTC.1999.776189

关键词:

摘要: The rate of moisture diffusion in the IC packaging materials was found to be dependent not only on concentration gradient as described by Fick's Law, but also itself. This non-Fickian behaviour poses a challenge for characterisation diffusivity which is conventionally based law. paper presents an integrated non-linear finite element modeling and optimisation procedure that capable characterising function from single sorption experiment.

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